http://www.blogcdn.com/www.engadget.com/media/2012/02/2012022401.jpgMarvell was first to introduce a single-chip LTE world modem with support for multiple mobile standards late last year, and now Panasonic Mobile Communications, NTT DoCoMo, NEC and Fujitsu have developed intellectual property (hardware and software) for something similar of their own. The companies have tested an “engineering sample” of a large-scale integration chip (pictured) for modems in mobile devices, and claim that it uses twenty percent less juice than two-chip designs – along with being cheaper to make. Past that, the chip has successfully provided “interconnectivity between the mobile networks of major vendors,” getting it a step closer to production. The silicon lets modems play nice with FDD-LTE, TDD-LTE, GSM, W-CDMA and HSPA+, specifically, and LTE-Advanced support is in the cards for the future. Although Panasonic, DoCoMo, NEC and Fujitsu are the main partners, other “major players” are said to be on board for a “joint venture,” with the goal of commercializing it in countries including Japan. The word’s mum on when we can expect the chip to make it past the sampling phase, but in the meantime, hit up the press release after the break for more knowledge.Continue reading Panasonic, DoCoMo, NEC and Fujitsu create IP for multi-standard LSI chip; supports LTE, GSM, W-CDMA and HSPA+
Panasonic, DoCoMo, NEC and Fujitsu create IP for multi-standard LSI chip; supports LTE, GSM, W-CDMA and HSPA+ originally appeared on Engadget on Mon, 27 Feb 2012 14:05:00 EDT. Please see our terms for use of feeds.
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