Apparently Intel has a 2- year lead in chip manufacturing using 3-d architecture. Taiwan semi and other foundries ar now starting to respond with FINFET(?) design. Where current conducting channels are laid on their side like fins. But they are using most of the old circuitry for connections. So will get to use only about 40 pct (?) Of the chip.
Intel also has a family of chips known by Silver something. Apparently it is more advanced. And can go to 14 nm shortly.
So for the experts here, has INTEL turned the corns in the mobile space?
Contents from memory - hard copy magazine.